Diamond Grinding Wheels

Diamond Grinding Wheels

Ceramic bond diamond grinding wheel

Appliable material: Semiconductor wafers and solar wafers, PCD (drill bits),CVD,PCBN,tungsten carbide,engineering structural ceramics,gem,crystal,magnetic material and other hard and brittle material.

Resin bond diamond grinding wheel

Appliable material :Non metallic materials,tungsten carbide, ceramic, agate, optical glass, semiconductor materials,cast iron,stone and so on.

Metal bond diamond grinding wheel

Appliable material:Glass,ceramic,silicon wafer,floor slab,marble,granite,concrete,semiconductor materials and super hard materials.

Features

Good for non metallic materials.

High efficiency and low consumption.

High accuracy.

Good thermal conductivity.

Good self-sharpening.

Less heat in grinding, fewer burned workpiece.

Predictable quality and shape for the workpiece.